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400-888-0829
Copper Wire Ultrasonic Bonding Machine
Application
IGBT, Automobile electrics, Laser facilities, Car-mounted charging stations
Features
Double drive control mode.
Marble platform.
Online welding quality monitoring.
In-line transport pulltester (ALC).
Magnetic spring compensation technology.
New GBS reduces consumable replacement time.
Technical Parameter
X, Y Axes
Linear motors, 0.1μm Resolution
Bond Area
300㎜*300㎜
Z-Axis
0.1 Resolution
Z-Stroke
50㎜
R-Axis
Direct Drive, ±220°, 0.096° Resolution
Repeatability
±3μm at 3σ
Wire Range
200-500μm Diameter
Bond Head
Front cutting or back cutting
Bond Pressure
Programmable, 500-5000g
Accuracy
＜2000g, ±5g. ＞2000g, ±3%
Dimensions
800㎜(W)*1600㎜(D)*1850㎜(H)
Weight
1200kg
滬公網安備 31011202013830號